HorngCom, RRP Electronics Expand OSAT in India Targeting $12M Revenue
HorngCom Technology of Taiwan has entered into a strategic collaboration with Mumbai-based RRP Electronics to expand Outsourced Semiconductor Assembly and Test (OSAT) capabilities in India. The agreement follows a successful technical assessment of RRP’s semiconductor facility in Mahape, Mumbai, and marks HorngCom’s latest move to scale operations globally. The partnership will see RRP’s Level 1 OSAT facility upgraded with a new production line to manage additional OSAT workloads. Products to be handled at the site include SIM cards, NAND memory chips, MOSFET components, and other integrated circuit (IC) products. Projected revenue from the collaboration is estimated at $12 million for the current financial year. “This collaboration reflects our capabilities and infrastructure readiness,” said Rajendra Chodankar, chairman of RRP Electronics. “We look forward to a long-term partnership that brings mutual growth and innovation to the semiconductor sector.” Elmer LingHu, chairman of HorngCom Technology, added that India presents an enormous growth opportunity. Both companies indicated that further initiatives are being planned to strengthen the partnership and expand their presence in the global semiconductor value chain. India recently also announced its sixth semiconductor manufacturing unit to be located in Uttar Pradesh near Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) area. This would be a joint venture between HCL and Foxconn. RRP Electronics recently became the first Indian company to export packaged semiconductors under the Government of India’s Semiconductor Mission (ISM). The company exported its first consignment, valued at ₹6.51 crore, primarily focused on ASICS-based technologies, to a European customer. This is a significant step in India’s semiconductor manufacturing sector, even as the customer details are unknown. In addition to these developments, RRP Electronics is setting up an advanced packaging foundry with US-based Deca Technologies to produce parts for Apple iPhones, contributing to the rise in iPhone manufacturing in India. In early March, RRP partnered with Singapore-based PTW to set up India’s first major silicon wafer production line. Pilot production is expected to begin in 2025–26. This move would reduce India’s reliance on electronics imports and support the country’s ‘Make in India’ ambitions.
The partnership will see RRP’s Level 1 OSAT facility upgraded with a new production line to manage workloads.
The partnership will see RRP’s Level 1 OSAT facility upgraded with a new production line to manage workloads.
["OSAT", "OSAT India", "partnership India", "RRP Electronics", "Semiconductor India", "semiconductor manufacturing"]
["OSAT", "Go", "programming_languages:R", "AI", "innovation", "OSAT India", "programming_languages:Go", "semiconductor manufacturing", "Semiconductor India", "RRP Electronics", "partnership India", "R"]
["AI", "R", "Go", "innovation", "programming_languages:R", "programming_languages:Go"]
An information designer who loves to learn about and try new developments in the field of tech and AI. She likes to spend her spare time reading and exploring absurdism in literature.